| Alternative NSN: 5961-01-349-0238 |
| Item Name: Semiconductor Devic |
| CAGE Code : 96095 , 07263 , 04713 , 28480 , 1LQK8 , 27014 , 37695 , D0894 , 1W698 |
| NIIN: 013490238 |
| FSC Name: 5961 Semiconductor Devices and Associated Hardware |
| NCB Code: USA (01) |
| Manufacturers: avx corporation , fairchild semiconductor corp , freescale semiconductor inc , hewlett-packard company , keysight technologies inc , national semiconductor corporation , raytheon company , rohde and schwarz inc , siemens components inc |
|
Part No Part No
|
Manufacturer |
Item Name Item Name
|
QTY QTY
|
RFQ RFQ
|
|---|---|---|---|---|
| BAS16 | avx corporation | semiconductor devic | Avl | |
| BAS16 | fairchild semiconductor corp | semiconductor devic | Avl | |
| BAS16L | freescale semiconductor inc | semiconductor devic | Avl | |
| BAS16T1 | freescale semiconductor inc | semiconductor devic | Avl | |
| 1901-1227 | hewlett-packard company | semiconductor devic | Avl | |
| 1901-1227 | keysight technologies inc | semiconductor devic | Avl | |
| BAS16 | national semiconductor corporation | semiconductor devic | Avl | |
| 380442-1 | raytheon company | semiconductor devic | Avl | |
| AD0074924 | rohde and schwarz inc | semiconductor devic | Avl | |
| BAS16 | siemens components inc | semiconductor devic | Avl |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABMK | OVERALL WIDTH | 0.1023 INCHES MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-236 |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 PRINTED CIRCUIT |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 75.0 MAXIMUM REVERSE BREAKDOWN VOLTAGE,INSTANTANEOUS |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES NOMINAL AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| ABHP | OVERALL LENGTH | 0.1197 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.0472 INCHES MAXIMUM |
| CTRD | POWER RATING PER CHARACTERISTIC | 300.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| AXGY | MOUNTING METHOD | TERMINAL |
| MATT | MATERIAL | PLASTIC INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
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