| Alternative NSN: 5962-01-108-8797 |
| Item Name: Microcircuit Memory |
| CAGE Code : 81413 , 94756 , 53908 , 16236 , 07933 , 91417 , 07187 , 50364 , 27014 , 98747 , 18324 , 36378 , 13499 |
| NIIN: 011088797 |
| FSC Name: 5962 Microcircuits Electronic |
| NCB Code: USA (01) |
| Manufacturers: bae systems inc , boeing company the , computer automation inc , dla land and maritime , fairchild semiconductor corp , harris corporation , honeywell international inc , mmi amd , national semiconductor corporation , ogden air logistics center , philips semiconductors ltd , raytheon technical services company , rockwell collins aerospace |
|
Part No Part No
|
Manufacturer |
Item Name Item Name
|
QTY QTY
|
RFQ RFQ
|
|---|---|---|---|---|
| 312213-001 | bae systems inc | microcircuit memory | Avl | |
| 477-1434-004 | boeing company the | microcircuit memory | Avl | |
| 01-45240-20 | computer automation inc | microcircuit memory | Avl | |
| ROM PROM HEAD 028 | dla land and maritime | microcircuit memory | Avl | |
| 29633DM | fairchild semiconductor corp | microcircuit memory | Avl | |
| 143736-203 | harris corporation | microcircuit memory | Avl | |
| 4040967-604 | honeywell international inc | microcircuit memory | Avl | |
| MM6381-1J | mmi amd | microcircuit memory | Avl | |
| 5381-1 | mmi amd | microcircuit memory | Avl | |
| DM875181N | national semiconductor corporation | microcircuit memory | Avl | |
| 7823817 | ogden air logistics center | microcircuit memory | Avl | |
| N82S181F | philips semiconductors ltd | microcircuit memory | Avl | |
| 4014313-01 | raytheon technical services company | microcircuit memory | Avl | |
| 351-1949-020 | rockwell collins aerospace | microcircuit memory | Avl |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.205 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.4 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/209 GOVERNMENT SPECIFICATION |
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